The 2024 SPIE Photomask Technology and EUV Lithography conferences showcased the optimism and enthusiasm surrounding the semiconductor industry, driven by strong growth in the photomask sector and advancements in high-NA EUV lithography. Experts and professionals gathered to discuss the progress and challenges in the field, including the ongoing focus on EUV mask-related issues and the development of pellicles for EUV lithography. High-NA lithography presented new opportunities and challenges, with a spotlight on solutions for stitching and patterning large chips. Multi-beam mask writers were also highlighted for enabling the fabrication of masks with small features and low line-edge roughness. The need for infrastructure to support curvy features on photomasks was addressed, along with continued advancements in EUV resist technology. Sustainability and green chemistry in lithography were also a key focus, with a company presenting a PFAS-free electron beam resist as a promising solution. Overall, the conference emphasized the industry’s progress towards future nodes and more complex devices while considering environmental concerns. The event was a success, showcasing the industry’s commitment to innovation and collaboration.
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Photo credit semiengineering.com
